Dual Inline Package and Chip

Question

I am checking out for dual-inline packages for my chip (which I want to insert in DIP) and I came across some products from Analog Devices, Texas Instruments and NTK Ceramics. However, NTK Ceramics have dimensions for the chip Die. But Analog devices and the Texas Instruments doesn't have any information about the Die for DIP.
Are the DIPs from Analog Devices and Texas Instruments just only programmable without any option to ınsert our own chip into the DIp?
You can find the picture of the datasheet of 24 pin DIP of Texas Instruments (İt doesn't have any picture of the Die)    and Also  you can find the other picture of DIP from NTK Ceramics which has die information shown clearly

analogsystemsrf · Answer

Often the  die cavities can be selected, based on the aspect ratio (length and width of the silicon chip) and the silicon area.
You want to nearly FILL the cavity, for good heat removal, since most of the heat (at least for plastic) has to flow FROM the silicon THRU the plastic and then TO THE LEADFRAME.
Thus for plastic, a small die in a large cavity is BAD THERMAL DESIGN.
The black epoxy has 200X the thermal resistance of silicon and copper(the lead frame often is alloy of steel and copper).
And those gold bond wires are about 10,000 ° C  per watt, per milliMeter of wire.

Dual Inline Package and Chip

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